Semiconductor Automatic Taping Machine SolidWorks, 3D Exported

Automatic braiding machine 3D model This is the semiconductor braiding machine equipment, the design principle is to use 45 degrees of gravity down the way to make the product in the material tube can flow down from the material tube itself, in the middle to prevent the material is also added to the blowing function, braiding packaging is done by 45 degrees of pick and place material robot, this robot pick and place material speed is also very fast, the middle can see a CCD vision camera has in the detection A CCD vision camera can be seen in the middle.