IC Bonding Machine SolidWorks, 3D Exported

This is the main moving mechanism of IC bonding machine, the principle is to bond IC on the glass, automatic bonding machine used in mass production. As long as you machine debugging, when very stable, we now have a lot of varieties of automatic bonding machine, but the principle is the same, the glass from the conveyor belt suction up, and then placed on the ACF platform alignment pressure ACF, and then pre-pressure arm will be glass suction on the pre-pressure platform, pre-press IC and then placed on this pressure platform, for this pressure.