DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported

0
Published by: Kenan Prather

Register to Download
Just 2 Minutes

Magazine Discharge Module : The completed die bonder or substrate is sent to the magazine discharge module via the transfer mechanism to be collected and stacked neatly in the magazine, and the empty magazine can be replaced automatically when the magazine is full. This module is a common standard module in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!

Specification: DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported

Design Software

,

Version

File Formats

, ,

Editable

Sharing Level

User Reviews

0.0 out of 5
0
0
0
0
0
Write a review

There are no reviews yet.

Be the first to review “DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported”

DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported
DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported
Mechanical Engineering Design Library
Logo
Shopping cart