Chip Component High Temperature Test After Carrier Tape Packaging Machine SolidWorks, 3D Exported
SMD components after high-temperature test carrier packaging machine 3D model SolidWorks2014 software design Sldprt, Sldasm source files + STEP common file to provide, the SMD components tested directly into the carrier, on the SMT machine, this machine can be multiple components at the same time for testing. The equipment is referred to as: high temperature test packaging machine, decompression more than 120M, the structure is relatively complete, is a good set of learning and research model, welcome to download.
Specification: Chip Component High Temperature Test After Carrier Tape Packaging Machine SolidWorks, 3D Exported
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