With Assembly Line Type Elevator

This equipment mechanism is designed by SW2016 including parts features can be edited. It is suitable for chip component placement in semiconductor IC production process (back channel packaging) to realize dispensing, dipping, gluing, chip placement, wafer gluing, inverted packaging, GaAs, with controllable gluing pressure and high precision. Adopting precision magnetic levitation motion platform, the main system X and Y axes adopt contactless and frictionless magnetic levitation system with high resolution linear encoder. The encoder scale reaches 0.02??m accuracy, which can realize high speed, precision and sub-micron level positioning. Rotation angle: The equipment has 360 degree rotation function and the rotation resolution accuracy is 0.01 degree, which can realize chip placement at any angle during the assembly process. Includes STP and UG universal editable format.