Wafer Lifting Mechanism + Wafer Transfer Mechanism (CreoProE), 3D Exported
Wafer lifting mechanism : Wafers are fed in baskets, and the baskets are lifted and indexed on the feeding module to enter and exit the baskets wafer transfer mechanism : Wafers are taken out of the baskets by the wafer transfer mechanism and sent to the wafer table for wafer pickup, and after all wafers are picked up, they are sent to the baskets by the transfer mechanism for wafer exchange. The module is a standard module used in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!
Specification: Wafer Lifting Mechanism + Wafer Transfer Mechanism (CreoProE), 3D Exported
|
User Reviews
Be the first to review “Wafer Lifting Mechanism + Wafer Transfer Mechanism (CreoProE), 3D Exported”
You must be logged in to post a review.
Wafer Lifting Mechanism + Wafer Transfer Mechanism (CreoProE), 3D Exported
There are no reviews yet.