Suspension Chain Infrared Oven SolidWorks

This device mechanism designed by SW2016 includes part features that can be edited, and uses the thin SO6L package optocouplers “TLP5705H” and “TLP5702H”, which can be used as insulated gate driver ICs in small IGBTs / MOSFETs. They can be used as insulated gate driver ICs in small IGBTs/MOS MOSFETs, and can be positioned using a racking machine to improve yield and productivity. The thin assembly (SO6L) with a thickness of only 2.3 mm (maximum) can provide products with ??5.0A peak output current rating. Rational design of assembly action tempo improves accuracy and efficiency, and increases the process that guarantees yield. The TLP5702H has a peak output current rating of ??2.5 A. The SO6L package is compatible with the pads of the SDIP6 package, enabling greater flexibility in the layout of board components and supporting back side mounting of the board, and the component loading method consists of Two sets of cylinders up and down at the same time to deformation of the pins for the whole foot leveling, the upper cylinder and the whole foot press is responsible for leveling, speed up to 2000, a wide range of applications for the new circuit design of the device height restrictions. Maximum operating temperature ratings are all up to 125??C (Ta = -40??C to 125??C), making it easier to design and maintain temperature margins. lead molding options for SO6L (LF4) packages. High peak output current ratings (@Ta = -40??C to 125??C) IOP = ??2.5A (TLP5702H) IOP = ??5.0A (TLP5705H) Thin SO6L package high operating temperature ratings: Topr (max) = 125??C Key Specifications ??C, @Ta = -40??C to 125. Includes STP with UG universal editable format.