OLED COF Automatic Bonding Equipment 3D Exported
COF is a technology that fixes the driver IC on the flexible circuit board with a flexible substrate circuit by using a flexible additional circuit board as a carrier for the chip to be bonded to the flexible substrate circuit,
Bonding machine is an important equipment in the COF process, mainly used in the LCD and OLED industries.
This equipment contains the entire structure of Bonding machine, which can be modified and edited for reference of related industries. Flexible OLED screen with COF packaging technology.
Specification: OLED COF Automatic Bonding Equipment 3D Exported
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