Die Bonder Mounter-Substrate Material Transfer Mechanism (CreoProE), 3D Exported
The gripper grips the lead frame or substrate by index transfer to the dispensing area for positioning and glue painting, then another set of gripper gripper transfers to the laminating area for visual inspection and positioning, then the pick and place device performs the chip laminating operation, and then transfers to the discharge area after the chip is laminated. This module is a standard module commonly used in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!
Specification: Die Bonder Mounter-Substrate Material Transfer Mechanism (CreoProE), 3D Exported
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