Semiconductor packaging equipment DB infeed module equipment magazine infeed : The pre-positioned wire frame or substrate in the magazine is taken out one by one, and then sent to the transfer track by the transfer mechanism for indexing and transferring work. This module is a standard module commonly used in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!
Specification: DB Feed Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported
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