12″ Wafer Rotary Positioning Mechanism Semiconductor Packaging Standard Mechanism (CreoProE), 3D Exported

This mechanism is standard for semiconductor packaging equipment. The wafer table module contains an XY module driven by a linear motor, a Z-axis driven by a motor, and a rotation mechanism for the production of 12-inch wafers. Wafer expansion mechanism: After cutting, wafers are adhered to blue tape and then fixed to the wafer frame. When the wafers are sent to the table, they are first expanded by the expansion mechanism and then taught to position by the vision system. Wafer table: The main function is to carry the wafer, it accepts the command from the control system, moves the chip to the position to be removed, and allows the pick and place device to implement the chip removal work.